Desco® 81272 Hi Temp Tape, 3/4in x 36yds

Product Details:

• Removal leaves little or no residue
• Masking off PCBs for IR reflow ovens or wave soldering under 572°F (300°C) ~ 10 seconds
• Near zero voltage generation when tape removed from PCB (at 50% relative humidity)
• Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)
• Low-sloughing plastic core
• Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
• For best results apply to board using a rubber roller
• Adhesive surface resisitivity
  10E3 to 10E4 Ohms
• Max Temperature
  572°F (300°C) 10 seconds
• Adhesive Strength
  1 N/cm (DIN), 5 oz/in² (ASTM)
• 1.0 mil thick (0.0254mm) Polyimide Film (DuPont Kapton® or equivalent)
• Conductive Polysiloxide Adhesive
• Total Thickness
  0.060 mm (DIN), 2.4 mil (ASTM)
• Color
  Brown opaque
• Adhesive Type
  Silicone
• Tensile Strength
  50 N/cm (DIN), 28 lbs/in² (ASTM)
• Elongation
  70% (DIN & ASTM)
• Lead-free RoHS compliant

ANSI/ESD S20.20 requires that all nonessential insulators, such as those made of plastics and paper, must be removed from the workstation. Substituting antistatic tape for regular tape (a very high tribocharging insulator) protects your ESD susceptible products.