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BGA REWORK SYSTEM

BGA REWORK SYSTEM

Item #: PAC-8007-0467
Pace ThermoFlo System TF2700

PACE's ThermoFlo System TF 2700 is the next generation in automated, cost effective solutions for area array package rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success! Designed for today's PCBs, ThermoFlo Rework Systems can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs. The PC based software is so advanced that creating profiles has never been easier! The PC software guides the operator through an intuitive interface that virtually automates the process.

All operations: component pick-up, alignment, placement, and reflow are completed in a single axis, eliminating the risk of component movement after placement. The PCB holders features fine micrometer adjustment for the most delicate X and Y axis alignments. Precise and accurate, within 25 µm (.001"), Z axis movement is ensured through a twin rail, linear bearing motion control assembly that is similar to those used on automated pick and place equipment. The optic systems utilize advanced digital, color cameras and the highest quality prism available for amazing image clarity. ThermoFlo systems combine convective top-side heating with remarkably stable and powerful IR bottom-side heating for the most effective, repeatable heating process available today. Both systems are self-contained and do not require an external air supply or vacuum connections. Upgrade your area rework capabilities and throughput with ThermoFlo!

Technical Specifications:
  • Power Requirements:120VAC, 60Hz
  • Temperature setting range: Top Heater: 100° to 400°C (212° to 750°F) Bottom Heater: 100° to 221°C (212° to 430°F)
  • Dimensions:815mm (32") H x 737mm (29") W x 790mm D (31")(PCB holder rails increase width to 1140 mm (45")
  • Weight (w/out computer): 91kg (200lbs.)
  • Heater (top side):IR, 1300 Watts (400 Watts x 1 & 150 W x 6)
  • Heater (bottom):405mm x 405mm (16" x 16")
  • Max component size:65mm x 65mm (2.5" x 2.5")
  • Max PCB size:610mm x 610mm (24" x 24")
  • Air Flow maximum: Self contained, PC controlled, adjust up to 20 SLPM
  • N2 Option: Standard
  • Resolution on Optics Adjustment:0.52mm (0.02") per rotation
  • Positioning Accuracy (Z axis): ± 25 µ meters (0.001")
  • Vacuum: 450mm Hg
  • Optics: High resolution, Vision Overlay System
  • Video inputs: 2 Composite Video 1 "S" Video (for alignment optics)
  • Video Monitor Viewable area:431mm (17") Integrated Color flat Panel LCD Monitor
  • Board Supports: Included
  • Optical Alignment Kit: Included

    User Manual Data Sheet


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