Soder-Wick® offers the state of the art in desoldering technology. Soder-Wick® is designed for today¦s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. A full range of sizes and flux types are available, including Rosin, No Clean, unfluxed and a high temperature Lead-Free version. Whatever the requirement, Soder-Wick® has the answer.

STATIC DISSIPATIVE PACKAGINGSoder-Wick® SD is packaged on Static Dissipative bobbins in 5 and 10-foot lengths to minimize the risk of damage associated with static electricity. The static dissipative bobbins qualify as electrostatic discharge protective per MIL-STD-1686C, MIL-STD-2000A and MILHDBK-263B, and meet the static delay rate provision of MIL-B-81705C.

features:

• Requires little or no post solder cleaning
• No corrosive residues
• Optimized construction for faster wicking and heat transfer
• Halide free
• Minimizes the risk of heat damage to components and circuit boards

Size#	Width Inches	Color	Width Metric
1	.030"	White	0.8mm
2	.060"	Yellow	1.5mm
3	.080"	Green	2.0mm
4	.110"	Blue	2.8mm
5	.145"	Brown	3.7mm
6	.210"	Red	5.3mm
BGA	-	Purple	-

Additional Specifications:

• ANSI/IPC J STD-004
• MIL-F-14256 F

No Clean Flux Spec:

• MIL-STD-883B
• Bellcore TR-NWT-000078
• ANSI/IPC J SF818

2 Year Shelflife

Spec Sheet

MSDS