Kester® EM907 No-Clean Lead-free Solder Paste, 500 gram jar

Alloy: Sn96.5Ag3.0Cu0.5
Metals %: 88.5
Mesh: Type 3

Kester® EnviroMark 907 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the Sn96.5Ag3.0Cu0.5 (SAC305) alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6"/s (150mm/s).

• Meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.

(57-3043-9909)

SPEC SHEETS

MSDS for EM907