Kester® R520A Water-Soluble Lead-free Solder Paste, 500 gram jar

Alloy: Sn96.5Ag3.0Cu0.5
Metals %: 89.5
Mesh: Type 3

Kester® R520A is a lead-free, organic acid, water-soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5(SAC305). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications.(0.5mm/20mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and immersion Gold over Electro-less Nickel(ENIG) boards.

• Meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.

(57-3843-8109)

SPEC SHEETS

MSDS for R520A