TerchSpray® 1978 Heat Sink Compound

A silicone free compound applied under power transistors and other devices that generate heat to assist in transferring heat from generating objects to metal chassis for dissipation. Product will not harden, dry out, melt, or contaminate wave solder baths. Designed to eliminate the phenomenon of silicone migration. Product has a functional temperature range from -40°C (-40°F) to 200°C (392°F).

Features:

• Functional Temperature Range (-40°C to 200°C)
• Will Not Harden
• Silicone Free

Spec Sheet

MSDS