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Kester® Lead-Free Solder Paste
   

Kester® NXG1 Lead-Free No-Clean Solder Paste
Lead-Free No-Clean Formula - For Stencil Printing
Kester NXG1 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 20 mils without any kneading. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is classified as Type ROL1 flux under IPC ANSI/J-STD-004A.

Click part number for detailed information and cart.

Alloy

Part No.

Container Metal % Temp/Humidity Powder Mesh Size
Sn96.5Ag3.0Cu0.5 SAC305NXG1-600G 600 Gram Cartridge 88.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500
-400/+500
Sn96.5Ag3.0Cu0.5 SAC305NXG1-500G 500 Gram Jar 88.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500
-400/+500

EnviroMark™ 907
Lead-Free No-Clean Formula - For Stencil Printingng
Kester's EnviroMark™ 907 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6"/s (150 mm/s). EM907 is classified as Type ROL0 per by J-STD-004.

 
Alloy

Part No.

Container Metal % Temp/Humidity Powder Mesh Size
Sn96.5Ag3.0Cu0.5 SAC305EM907600G 600 Gram Cartridge 88.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500
-400/+500
Sn96.5Ag3.0Cu0.5 SAC305EM907500G 500 Gram Jar 88.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500
-400/+500

EnviroMark™ 828
Low-Voiding Lead-Free Water Soluble - For Stencil Printing
Kester EnviroMarkTM 828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes. EM828 is classified as Type ORH1 per IPC J-STD-004A.
 

Alloy

Part No.

Container Metal % Temp/Humidity Powder Mesh Size
Sn96.5Ag3.0Cu0.5 SAC305EM828600G 600 Gram Cartridge 89.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500
Sn96.5Ag3.0Cu0.5 SAC305EM828500G 500 Gram Jar 89.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500

R520A Lead Free Water Soluble Solder Paste
Water Soluble Stencil Printing
Kester R520A is a lead free, organic acid, water-soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards. R520A is an extremely stable water-soluble formula. Classification: ORH0 per J-STD-004.
 

Alloy

Part No.

Container Metal % Temp/Humidity Powder Mesh Size
Sn96.5Ag3.0Cu0.5 SAC305R520A600G 600 Gram Cartridge 89.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500
Sn96.5Ag3.0Cu0.5 SAC305R520A500G 500 Gram Jar 89.5% 21°-25°C (70°-77°F) & 35-65% RH -325/+500

TSF-6592 Tacky Soldering Flux
Lead Free No-Clean - For stencil/screen printing - 30 gram syringe
Kester TSF-6592 is a No-Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux. Classification: ROL0 per J-STD-004.
 

Compatible with

Part No.

Stencil Life Viscosity Temp/Humidity Initial Tackiness
SnAg, SnCu, SnAgCu, SnAgBi, Sn96, SnPb

KES-TSF6592LV30

8+ Hours 186 Poise 21°-25°C (70°-77°F) & 35-65% RH 152 grams

TSF-6852 Tacky Soldering Flux
Lead Free Water Soluble - For stencil/screen printing - 30 gram syringe
Kester TSF-6852 is a synthetic water soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typically found in fluxes. This maximizes lot-to-lot consistency. TSF-6852 is room temperature stable and does not require refrigeration for long term storage. This reduces production line space for material storage and the cost of refrigerated storage. TSF-6852 has been formulated to be a drop in replacement for a variety of metallurgies. These include low melting point alloys (SnBi, SnBiAg, etc.), typical tin-lead eutectic and the higher melting point, lead-free alloys (SnAg, SnCu, SnAgCu, SnSb, etc.). Post reflow the residues are completely soluble in water and do not require any cleaning additives. To reduce the cost of assembling, room temperature or cool water (<65°C) can be used to remove TSF-6852 residues. Classification: ORH1 per J-STD-004.

Compatible with

Part No.

Stencil Life Viscosity Temp/Humidity Initial Tackiness
SnAg, SnCu, SnAgCu, SnAgBi, Sn96

KES-TSF6852-30G

8 Hours 200 Poise -- 61 grams

RF743
No-Clean Electronic-Grade Rework Flux for Lead-Free Applications
Kester RF743 is designed to be used with lead-free solder alloys. Kester RF743 is a high viscosity, no-clean flux designed for electronic component rework and repair applications. Kester RF743 has a gel-like consistency and is easily applied by syringe dispensing. Kester RF743 can be precisely dispensed onto a specific area that needs flux in hand soldering operations. After being dispensed, Kester RF743 stays in place until soldering occurs. Kestser RF743 was designed as the ideal companion flux for hand soldering a PCB that already includes the residues from Kester lead-free solderpaste. Traditional problems experienced with controlling the application of low solids no-clean liquid fluxes are eliminated with the use of Kester RF743. Residues that remain on surfaces after soldering are almost colorless, leaving a cosmetically appealing post-soldering appearance. The residue has high electrical resistance and can be left on the assembly after soldering. However, the residues can also be easily removed using traditional saponification cleaners, semi-aqueous or hydrocarbon-based solvents. Residues are compatible with all no-clean fluxes in the Kester product line. RF743 can be used in combinations with Kester no-clean coredwire solders and no-clean solder pastes, as well as no-clean liquid fluxes without any compatibility risks. Classification: ROL0 per J-STD-004. Compliant to Bellcore GR-78.
 

Compatible with

Part No.

Container Viscosity Shelf Life
Lead Free & Leaded Rework

KES-RF743-30G

30 Gram Syringe 925 Poise 1 Year


LeadCheck® Lead Detector Swabs
Easy to use, disposable LeadCheck Swabs will work on any surface, instantly turning bright Pink when lead is present. Each swab is ready to use. There are no hidden steps or lengthy procedures. LeadCheck Swabs are odorless, disposable and non-staining. The entire test procedure is so convenient that it can be performed anywhere in 30 seconds. There's even a test confirmation card to verify test results.

Part No.

Description
EWD-LCL-8 Lead Detector Swabs