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SAC305NXG1-600G

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SAC305NXG1-600G
 

Kester® SAC305NXG1-600G Lead-Free No-Clean Solder Paste, 600 Gram Cartridge
Alloy: Sn96.5 Ag3.0 Cu0.5
Metals: 88.5%
Mesh: -325+500 - Type 3

NXG1 lead-free no-clean solder paste represents a breakthrough in lead-free technology with a best-in-class combination of superior wetting behavior, shiny joints, excellent printing and the longest shelf life available. Backed by Kester's world renowned customer service, technical service expertise, and 110 plus years experience in soldering technology, NXG1 lead-free no-clean paste is the only product that satisfies all your assembly needs.

  • Superior Solderability
  • Ultra-Low BGA Voiding
  • Reduces Ball-in-socket Defects
  • Excellent Printability
  • Longest Shelf Life at 8 Months
  • Clear, Probeable Residues
  • (7032130811)

    SPEC SHEET

    MSDS

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